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Critical thickness of GaAs/InGaAs and AlGaAs/GaAsP strained quantum wells grown by organometallic chemical vapor deposition
Authors:Daniel C Bertolet  Jung-Kuei Hsu  Farid Agahi  Kei May Lau
Affiliation:(1) Compound Semiconductor Laboratory, Department of Electrical and Computer Engineering, University of Massachusetts, 01003 Amherst, MA
Abstract:In this paper we describe a study of strained quantum wells (QWs) as a means to experimentally observe the critical thickness (h c) for the formation of interfacial misfit dislocations. Two material systems were investigated: GaAs/In0.11Ga0.89As, in which the QW layers are under biaxialcompression, and Al0.35Ga0.65As/GaAs0.82P0.18, in which the QW layers are under biaxialtension. Samples were grown by atmospheric pressure organometallic chemical vapor deposition, and characterized by low-temperature photoluminescence (PL), x-ray diffraction, optical microscopy, and Hall measurements. For both material systems, the observed onset of dislocation formation agrees well with the force-balance model assuming a double-kink mechanism. However, overall results indicate that the relaxation is inhomogeneous. Annealing at 800–850° C had no significant effect on the PL spectra, signifying that even layers that have exceededh c and have undergone partial relaxation are thermodynamically stable against further dislocation propagation.
Keywords:GaAs/InGaAs  critical thickness  strained quantum wells
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