| 硅的准分子激光直写刻蚀微细加工特性研究 |
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| 引用本文： | 苑伟政,马炳和,李晓莹,李铁军,王丽戈,刘晶儒. 硅的准分子激光直写刻蚀微细加工特性研究[J]. 机械工程学报, 2000, 36(3): 107-110 |
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| 作者姓名： | 苑伟政 马炳和 李晓莹 李铁军 王丽戈 刘晶儒 |
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| 作者单位： | 1. 西北工业大学微机械与微细加工技术研究室西安 710072
2. 西北核技术研究所 |
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| 基金项目： | 陕西省自然科学基金资助项目. |
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| 摘 要： | 针对微机械三维结构对准分子激光直写微细加工的要求,在试验研究基础上,讨论了硅已加工表面形貌、加工热与热影响区等特性,得出了加工脉冲数、能量与刻蚀深度间的相互关系.
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| 关 键 词： | 准分子激光 硅微细加工 直写刻蚀加工 |
| 修稿时间： | 1998-07-24 |
ON THE CHARACTERISTICS OF Si MICRO-FABRICATION BY DIRECT ETCHING OF EXCIMER LASER |
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| Yuan Weizheng Ma Binghe Li Xiaoying. ON THE CHARACTERISTICS OF Si MICRO-FABRICATION BY DIRECT ETCHING OF EXCIMER LASER[J]. Chinese Journal of Mechanical Engineering, 2000, 36(3): 107-110 |
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| Authors: | Yuan Weizheng Ma Binghe Li Xiaoying |
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| Affiliation: | Yuan Weizheng Ma Binghe Li Xiaoying (Northwestern Polytechnical University) Li Tiejun Wang Lige Liu Jingru (Northwest Institute of Nuclear Technology) |
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| Abstract: | The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed. |
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| Keywords: | Excimer laser Si micro-fabrication Directetching |
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