| P对Sn-Cu无铅钎料性能的影响 |
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| 引用本文： | 李广东,史耀武,徐广臣,夏志东,雷永平.P对Sn-Cu无铅钎料性能的影响[J].电子元件与材料,2008,27(11). |
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| 作者姓名： | 李广东 史耀武 徐广臣 夏志东 雷永平 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124 |
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| 摘 要： | 添加了P到Sn-Cu系无铅钎料中,测定了钎料的熔化温度、抗氧化性能和接头蠕变疲劳寿命。结果表明:在Sn0.7Cu中添加微量的P,提高了无铅钎料的抗氧化性能,对熔化温度基本无影响。Sn0.7Cu0.005P无铅钎料合金熔化温度的峰值为226.7℃,在恒定应力为2MPa的蠕变疲劳试验中,钎料接头蠕变疲劳寿命为337.357min。
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| 关 键 词： | 电子技术 Sn0.7Cu钎料 P 蠕变疲劳寿命 |
Effect of phosphorus on the performance of Sn-Cu lead-free solder |
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| LI Guang-dong,SHI Yao-wu,XU Guang-chen,XIA Zhi-dong,LEI Yong-ping.Effect of phosphorus on the performance of Sn-Cu lead-free solder[J].Electronic Components & Materials,2008,27(11). |
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| Authors: | LI Guang-dong SHI Yao-wu XU Guang-chen XIA Zhi-dong LEI Yong-ping |
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| Affiliation: | LI Guang-dong,SHI Yao-wu,XU Guang-chen,XIA Zhi-dong,LEI Yong-ping (School of Materials Science & Engineering,Beijing University of Technology,Beijing 100124,China) |
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| Abstract: | Adding phosphorus in Sn-Cu lead-free solder, its melting temperature, oxidation-resistance behavior and the lifetime of joint creep fatigue were measured. The results show that the oxidation-resistance behavior is improved, the melting temperature is almost not changed with adding small amount of P. The peak melting temperature of Sn0.7Cu0.005P lead-free solder alloy is 226.7 ℃ under the constant stress of 2 MPa, and the creep fatigue lifetime of solder joint is 337.357 min. |
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| Keywords: | P |
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