| 图形电镀夹膜修理方法 |
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| 引用本文： | 肖劲松,卜凡勋.图形电镀夹膜修理方法[J].印制电路信息,2013(2):21-22. |
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| 作者姓名： | 肖劲松 卜凡勋 |
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| 作者单位： | 江苏省昆山市苏杭电路板有限公司,江苏昆山215341 |
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| 摘 要： | 图形电镀已经是PCB制造加厚铜的主要方式,夹膜问题是此工艺流程的一大顽疾,本文为各位同仁介绍一种有效、简便、实用的修理夹膜的方法.
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| 关 键 词： | 图形电镀 夹膜 修理方法 |
A repair method for dry-film residues between lines on pattern platting board |
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| Affiliation: | XIAO Jing-song PU Fan-xun |
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| Abstract: | Pattern platting is a main method to raise copper thickness for PCB. Before line etching, there is a hard problem that some dry film between lines can not been removed during strip process. This article will share an effective and simple and useful method to deal with the problem. |
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| Keywords: | Pattern Platting Dry Film Clamped between Lines Repair Method |
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