化学镀镍镀钯浸金表面处理工艺概述及发展前景分析

随着电子封装系统集成度逐渐升高及组装工艺多样化的发展趋势，适应无铅焊料的化学镀镍镀钯浸金（ENEPIG）表面处理工艺恰好能够满足封装基板上不同类型的元件和不同组装工艺的要求，因此ENEPIG正成为一种适用于IC封装基板和精细线路PCB的表面处理工艺。ENEPIG工艺具有增加布线密度、减小元件尺寸、装配及封装的可靠性高、成本较低等优点，近年来受到广泛关注。文章基于对化学镍钯金反应机理的简介，结合对镀层基本性能及可靠性方面的分析，综述了ENEPIG表面处理工艺的优势并探讨了其发展前景。

Study and development prospect analysis of ENEPIG surface treatment technology

With the development trend of gradually improved integration level of electronic package and the variety of packaging technologies, electroless Ni electroless Pd immersion Au （ENEPIG） finish which adapts the lead-free solder is just able to satisfy the demand of different components and packaging technologies, so ENEPIG finish is becoming a surface finish candidate in substrate fabrication for IC packages and fine PCB. ENEPIG finish with the advantages of increasing routing density, miniaturizing component size, high packaged reliability, relatively competitive in cost and so on has attracted wide attention in recent years. In this paper, the reaction mechanism, the fundamental characteristics and reliability of coating of the ENEPIG finish, as well as the advantages and development prospect of the ENEPIG finish are reviewed.