厚铜箔印制板尺寸稳定性研究

伴随着电源模块等大功率元器件的市场需求量不断加大,厚铜箔印制电路板的产量也不断增加,其对品质的要求也越来越严格。众所周知,厚铜箔印制电路板在其生产制作中产生的热膨胀系数量一直是影响其品质的重要因素,本文正是着眼于信息产业高科技、高精度的要求,通过对厚铜箔板的工艺流程、材料本身特点、设计三个因素来试验找出厚铜箔印制板系数补偿的重点考虑因素,同时对热膨胀系数量进行统计分析,从而保证厚铜板涨缩控制在范围之内,达到客户的要求。

Thick copper foil printed board size stability study

With the power supply module market demand constantly increasing, thick copper foil printed circuit board production increases constantly too. The quality request is becoming more and more strict. As is known to all, in the thick copper foil printed circuit board production, CTE is always influencing the quality of product. This paper is focused on high-tech information industry, high precision requirements, through the thick copper foil board process flow, material own characteristics, three design factors to find out thick copper foil printed circuit board compensation key factors. At the same time it carries on the statistical analysis to CTE, so as to ensure thick copper expansion control within the scope to meet customer requirements.