| 覆铜板用厚铜箔产品的性能及其应用 |
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| 引用本文： | 蒋卫东.覆铜板用厚铜箔产品的性能及其应用[J].印制电路信息,2013(2):13-17. |
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| 作者姓名： | 蒋卫东 |
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| 作者单位： | 中科英华高技术股份有限公司,上海200041 |
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| 摘 要： | 介绍了覆铜板用厚铜箔的定义、应用特性以及厚铜箔覆铜板市场,并重点讨论了厚铜箔所需达到的关键性能,以及它与PCB加工性、品质提高的关系.
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| 关 键 词： | 覆铜板 电解铜箔 厚铜箔 印制电路板 |
Performance and application of thick copper foil used in copper clad laminate |
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| JIANG Wei-dong.Performance and application of thick copper foil used in copper clad laminate[J].Printed Circuit Information,2013(2):13-17. |
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| Authors: | JIANG Wei-dong |
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| Affiliation: | JIANG Wei-dong |
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| Abstract: | In the paper, the definition and application of thick copper foil used in copper clad laminate were introduced. Market of copper clad laminate thick copper foil was analyzed. Key performance of thick copper foil was discussed. At the same time, the impact to PCB processability and quality improvement was reviewed. |
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| Keywords: | Copper Clad Laminate Electrodeposited Copper Foil Thick Copper Foil Printed Circuit Board |
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