| 基于Ag-Sn焊片共晶键合的MEMS气密性封装 |
| |
| 引用本文： | 陈继超,赵湛,刘启民,肖丽,杜利东.基于Ag-Sn焊片共晶键合的MEMS气密性封装[J].仪表技术与传感器,2012(6):6-7,28. |
| |
| 作者姓名： | 陈继超 赵湛 刘启民 肖丽 杜利东 |
| |
| 作者单位： | 1. 中国科学院研究生院,北京100039;中国科学院电子学研究所传感技术国家重点实验室,北京100190
2. 中国科学院电子学研究所传感技术国家重点实验室,北京,100190 |
| |
| 基金项目： | 国家重点基础研究发展计划(973计划)项目 |
| |
| 摘 要： | 研究了在MEMS气密性封装中基于Ag-Sn焊片的共晶键合技术。设计了共晶键合多层材料的结构和密封环图形,在221℃实现了良好的键合效果,充N2保护的键合环境下,平均剪切强度达到9.4 MPa.三个月前后气密性对比实验表明氦泄漏不超过5×10-4Pa.cm3/s,满足GJB548B—2005标准规定,验证了Ag-Sn共晶键合技术在MEMS气密封装中应用的可行性。
|
| 关 键 词： | 共晶键合 气密封装 Ag-Sn焊片 |
Eutectic Bonding for MEMS Hermetic Packaging Based on Ag -Sn Solder Film |
| |
| CHEN Ji-chao
,
ZHAO Zhan
,
LIU Qi-min
,
XIAO Li
,
DU Li-dong.Eutectic Bonding for MEMS Hermetic Packaging Based on Ag -Sn Solder Film[J].Instrument Technique and Sensor,2012(6):6-7,28. |
| |
| Authors: | CHEN Ji-chao ZHAO Zhan LIU Qi-min XIAO Li DU Li-dong |
| |
| Affiliation: | 1(1.State Key Laboratory of Transducer Technology,Institute of Electronics,Chinese Academy of Sciences,Beijing 100190,China; 2.Graduate University,Chinese Academy of Sciences,Beijing 100190,China) |
| |
| Abstract: | This paper introduced the eutectic bonding technology in MEMS hermetic packaging based on Ag-Sn solder film.The structure of multi-layer material for eutectic bonding and the pattern of sealing rings were designed.A good bonding effect was realized in the N2 protecting environment at 221 ℃,and the average shear strength was 9.4 MPa.Helium leak rate is no more than 5×10-4 Pa·cm3/s in the comparative experiments through three months,which meets the GJB548B-2005 standard and verifies the feasibility of Ag-Sn eutectic bonding technology in MEMS hermetic packaging. |
| |
| Keywords: | eutectic bonding hermetic packaging Ag-Sn solder film |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
