Suppression of tin whisker formation on fine pitch connectors by surface roughening

In the electronics industry, lead-free solder processes such as the terminal plating of electronic components, fine pitch connectors, and flexible printed circuits (FPCs) are invariably hampered by the serious problem of tin whisker formation. Here, a new and simple method, the JVC Micro Island (JMI) process, is proposed for the prevention of tin whisker formation in fine pitch connectors. Briefly, the base copper terminal was acid etched to afford a roughened surface, which was then tin plated. The contact test with Knoop indentation proved the effectiveness of the present process. The maximum length of the as-formed tin whiskers was less than 50 μm. The solderability of the JMI FPCs was not influenced by the present process. Thus, the new JMI process is shown to have a great advantage for the prevention of tin whisker formation in fine pitch connectors.