FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321 |
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| Affiliation: | 1. Laboratoire Brestois de Mécanique et des Systèmes EA4325, ENSTA Bretagne/ Université de Brest /ENIB/UEB, ENSTA Bretagne, 2 rue F. Verny, 29806 Brest Cedex 9, France;2. CNES, 52 rue Jacques Hillairet, 75012 Paris, France;1. Instituto de Ciência e Inovação em Engenharia Mecânica e Engenharia Industrial (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal;2. Departamento de Engenharia Mecânica, Faculdade de Engenharia (FEUP), Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal;1. DLR, German Aerospace Center, Lilienthalplatz 7, 38108 Braunschweig, Germany;2. Technische Universität Braunschweig, Institute of Adaptronics and Function Integration, 38106 Braunschweig, Germany;1. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha 410082, China;2. Faculty of Science, Engineering and Technology, Swinburne University of Technology, Melbourne 3122, Australia |
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| Abstract: | Cold-curing adhesives, characterized by an unsteady curing degree, present various advantages for assembling large scale structures set up under outdoor conditions. Thus various applications can be found in aerospace and automotive industries where structures are affected by thermal and mechanical loads. Hence, the curing state of the adhesive must be known to evaluate the lifetime of such bonded structures. The evolution of the polymerization of the adhesive Hysol EA-9321 during the curing process was examined in this paper. To that end, the curing degree of the adhesive was experimentally and analytically investigated for different curing cycles with a view to a potential application in the aerospace domain, where structures are assembled at low temperatures. Existing dynamic and isothermal curing models were applied to simulate the curing behavior of the adhesive. Then, an FEM model was developed to simulate the process of adhesive curing by taking into account a thermo-kinetic coupling. |
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| Keywords: | Adhesively-bonded joints Curing degree Thermal analysis |
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