| Sn-Ag-Cu-In无铅钎料润湿性能及显微组织 |
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| 引用本文： | 王俭辛,尹明,赖忠民,李雪. Sn-Ag-Cu-In无铅钎料润湿性能及显微组织[J]. 焊接学报, 2011, 32(11): 69-72 |
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| 作者姓名： | 王俭辛 尹明 赖忠民 李雪 |
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| 作者单位： | 江苏科技大学先进焊接技术省级重点实验室,镇江,212003 |
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| 基金项目： | 江苏高校优势学科建设工程资助项目; 江苏省高校“青蓝工程”科技创新团队资助项目; 江苏科技大学人才基金资助项目(35060904) |
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| 摘 要： | 在Sn-1.2Ag-0.6Cu合金中添加0～1.0%的In元素,研究了Sn-Ag-Cu-In无铅钎料的熔化温度、润湿性能及显微组织.结果表明,添加In元素对钎料的熔化温度有一定的降低作用,在相同的试验温度下,含铟钎料粘度更低,流动性更强,钎料的润湿性能随之改善.低银Sn-Ag-Cu钎料在空气中的润湿时间在260℃才达到...
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| 关 键 词： | 无铅钎料 润湿性 显微组织 |
| 收稿时间： | 2011-07-07 |
Wettability and microstructure of Sn-Ag-Cu-In solder |
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| WANG Jianxin,YIN Ming,LAI Zhongmin and LI Xue. Wettability and microstructure of Sn-Ag-Cu-In solder[J]. Transactions of The China Welding Institution, 2011, 32(11): 69-72 |
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| Authors: | WANG Jianxin YIN Ming LAI Zhongmin LI Xue |
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| Affiliation: | WANG Jianxin,YIN Ming,LAI Zhongmin,LI Xue(Province Key Lab of Advanced Welding Technology,Jiangsu University of Science and Technology,Zhenjiang 212003,China). |
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| Abstract: | In order to improve the properties of Sn-1.2Ag-0.6Cu solder,small amount of In(0~1.0%) was added to the base alloys,the melting temperatures of alloys were tested,and the effect of In on the wettability and microstructure of solder alloy was studied.The melting temperature decreases with the addition of In.At the same soldering temperature,the lower melting temperature is,the higher superheat is,thus the viscosity of liquid solder is decreased and fluidity is improved.The zero time of Sn-1.2Ag-0.6Cu in air ... |
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| Keywords: | lead-free solder wettability microstructure |
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