Photoresist application for the LIGA process

 Fabrication of high aspect ratio structures requires the use of a photoresist able to form a mold with vertical sidewalls. Thus the photoresist should have a high selectivity between the exposed and the unexposed area in the developer. It should be relatively free from stress when applied in thick layers necessary to make high aspect ratio structures. PMMA (Poly Methyl Methacrylate) is the photoresist of choice in the LIGA process, mainly for its ability to hold vertical sidewalls for tall structures. It is applied to the substrate by a glue-down process in which a pre-cast, high molecular weight, sheet of PMMA is attached to the plating base on a substrate. The applied photoresist is then milled down to the precise height by a fly-cutter prior to pattern transfer by x-ray exposure. The requirement that the applied layer be relatively free from stress dictates the choice of glue-down over casting. The substrate preparation steps, as well as the conditioning of the PMMA sheet prior to the glue-down, are done, in part, to reduce the stress in the glued down sheet of photoresist. The cutting of the PMMA sheet in the fly-cutter requires specific operating conditions as well as particular cutting tools to avoid introducing any stress and the resultant crazing of the photoresist. Received: 25 August 1997/Accepted: 3 September 1997