| 电子产品热电耦法温升测试的不确定度评定 |
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| 引用本文： | 钟继.电子产品热电耦法温升测试的不确定度评定[J].电子产品可靠性与环境试验,2009,27(3):31-33. |
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| 作者姓名： | 钟继 |
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| 作者单位： | 厦门出入境检验检疫局,福建,厦门,361022 |
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| 摘 要： | 对电子产品热电耦法温升测试的测量不确定度进行了分析和评定,为ISO/IEC17025体系实验室检测人员了解和掌握不确定度评定的具体方法提供参考。
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| 关 键 词： | 电子产品 热电耦 温升 测量不确定度 |
Uncertainty Evaluation for Temperature Rise Test of Electronics with Thermal Couple |
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| ZHONG Ji.Uncertainty Evaluation for Temperature Rise Test of Electronics with Thermal Couple[J].Electronic Product Reliability and Environmental Testing,2009,27(3):31-33. |
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| Authors: | ZHONG Ji |
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| Affiliation: | ZHONG Ji (Xiamen Entry-Exit Inspection and Quarantine Bureau, Xiamen 361022, China) |
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| Abstract: | The uncertainty of temperature rise measurement for electronics with thermal couple was analyzed and evaluated, and it is helpful for testers in the ISO/IEC17025 system laboratory to understand the approaches to uncertainty evaluation. |
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| Keywords: | electronics thermal couple temperature rise uncertainty in measurement |
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