半导体晶体线锯切割工艺研究

线锯切割技术在半导体晶体切割领域已经得到了广泛应用。对传统内圆切割技术进行了介绍，并针对新兴线锯切割技术的现有分类和研究水平做了总结，阐述了自由磨料线锯切割和固结磨料线锯切割两大类别的工作原理和研究进展。自由磨料线锯切割是取代内圆切割的一种广泛技术，而固结磨料线锯切割则是针对高切割效率要求的重要改进。针对晶体线锯切割技术所做的综述，有助于研究者了解前沿研究进展，把握晶体线锯切割的发展方向。

Study on Wire Sawing Technology of Semiconductor Crystal

Wire sawing technology has been widely used in the field of semiconductor crystal cutting. The traditional internal cutting technology is introduced, and the current classification and research level of the emerging wire saw cutting technology are summarized. The working principles and research progress of the two major categories of free abrasive wire saw cutting and consolidated abrasive wire saw cutting are explained. Free-abrasive wire saw cutting is a widely used technology to replace inner circular cutting, while solid-abrasive wire saw cutting is an important improvement for high cutting efficiency requirements. A review of cutting technology for crystal wire saws will help researchers understand cutting-edge research progress and grasp the development direction of crystal wire saw cutting.