Mechanically robust,electrically and thermally conductive graphene-based epoxy adhesives |
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| Authors: | Qingshi Meng Sensen Han Sherif Araby Yu Zhao Zhiwen Liu |
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| Affiliation: | 1. College of Aerospace Engineering, Shenyang Aerospace University, Shenyang, China;2. Department of Mechanical Engineering, Benha Faculty of Engineering, Benha University, Banha, Egypt;3. School of Engineering, University of South Australia, Mawson Lakes, SA, Australia |
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| Abstract: | This study develops a facile approach to fabricate adhesives consists of epoxy and cost-effective graphene platelets (GnPs). Morphology, mechanical properties, electrical and thermal conductivity, and adhesive toughness of epoxy/GnP nanocomposite were investigated. Significant improvements in mechanical properties of epoxy/GnP nanocomposites were achieved at low GnP loading of merely 0.5?vol%; for example, Young’s modulus, fracture toughness (K1C) and energy release rate (G1C) increased by 71%, 133% and 190%, respectively compared to neat epoxy. Percolation threshold of electrical conductivity is recorded at 0.58?vol% and thermal conductivity of 2.13?W m?1 K?1 at 6?vol% showing 4 folds enhancements. The lap shear strength of epoxy/GnP nanocomposite adhesive improved from 10.7?MPa for neat epoxy to 13.57?MPa at 0.375?vol% GnPs. The concluded results are superior to other composites or adhesives at similar fractions of fillers such as single-walled carbon nanotubes, multi-walled carbon nanotubes or graphene oxide. The study promises that GnPs are ideal candidate to achieve multifunctional epoxy adhesives. |
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| Keywords: | Graphene epoxy adhesives electrical conductivity lap shear strength |
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