水射流技术在集成电路制造工艺中的应用

半导体器件制造过程中通常采用锯片来切割芯片和封装元件.锯片一般只能切割直线轮廓,对于曲线轮廓或复合层材料,锯片切割会遇到很大的问题.水射流技术作为一种新的加工工艺,被成功引入到半导体制造行业.通过对半导体加工工艺的分析,介绍了水射流切割技术在半导体制造工艺中的应用.研究表明,水射流切割作为一种冷切割工艺,其显著特点是被加工工件没有热影响区,因此加工的半导体器件的机械强度大大提高,而且水射流切割既可以切割直线轮廓,也可以切割曲线轮廓或沟槽.另一方面,由于无切向力存在,器件定位容易,加工轮廓精度高,切割速度快,且对加工材料没有选择性.因此,采用微细水射流切割技术,可以极大地提高半导体器件的产量、质量和可靠性.

Application of Waterjet Technology in Semiconductor Process

Saw blades is employed during semiconductor manufacturing process.It can only cut straight lines through device arrays.It cannot be used to cut small semiconductor devices and curvilinear photonic devices.Abrasive waterjet is one of the newly cutting technologies and is successfully applied to semiconductor process.By analysis of semiconductor manufacturing process,water jet applications in semiconductor process were introduced.It shows that water jet cutting is a cold cutting process.The significant advantage of waterjet cutting is that it has no heat affected zone.Therefore the strength of semiconductor device is enhanced.Moreover,Waterjet can cut straight lines and curvilinear paths.On the other hand,due to nearly no side reactive forces along the cut path,precise positioning is very easy and conforming geometries could be obtained.The cutting speed is also rapid.Additional to this,water jet can cut almost any materials.Consequently by employing water jet technology,the quantity,quality and reliability of semiconductor device are greatly improved.