Adhesion characterization of no-flow underfills used in flip chipassemblies and correlation with reliability |
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| Authors: | Jicun Lu Smith B Baldwin DE |
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| Affiliation: | George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA; |
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| Abstract: | Adhesion is one of the key properties of underfills used in flip chip assemblies. This paper characterizes the adhesion strengths of no-flow underfill materials to various die passivations using the shear test techniques. A novel shear test vehicle with planner underfill layers between the die and substrate is presented. The adhesion strengths and failure modes of the no-flow underfill materials during shear testing correlate well with their thermal shock reliability test results. Underfill adhesion related failures such as delamination and crack are investigated and correlated between flip chip assemblies and shear test vehicle assemblies without solder joint interconnects |
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