A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties |
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| Authors: | Wan‐Lung Wu Kung‐Chung Hsu Wu‐Hsun Cheng |
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| Affiliation: | 1. Department of Chemistry, National Taiwan Normal University, Taipei, Taiwan 116, Republic of China;2. Shinkong Synthetic Fibers Corporation, Taipei, Taiwan 104, Republic of China |
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| Abstract: | A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and 1H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 |
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| Keywords: | additives dielectric properties resins synthesis thermal properties |
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