| 共混在热熔胶配方设计中的应用 |
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| 引用本文： | 赵飞,顾继友,李晓萍,翁向丽,黄元波. 共混在热熔胶配方设计中的应用[J]. 粘接, 2003, 24(6): 40-42 |
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| 作者姓名： | 赵飞 顾继友 李晓萍 翁向丽 黄元波 |
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| 作者单位： | 东北林业大学,材料科学与工程学院,哈尔滨,150040 |
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| 摘 要： | 简要介绍了热熔胶的发展状况和前景。并就与热熔胶的制备及改性相关的聚合物共混理论进行了详细阐述。
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| 关 键 词： | 共混 热熔胶 配方设计 应用 改性 IPN 互穿聚合物网络 |
| 文章编号： | 1001-5922(2003)06-0040-03 |
| 修稿时间： | 2003-05-27 |
Application of blending in compounding formulations of hot melt adhesives |
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| ZHAO Fei GU Jiyou LI Xiaoping WENG Xiangli HUANG Yuanbo. Application of blending in compounding formulations of hot melt adhesives[J]. Adhesion in China, 2003, 24(6): 40-42 |
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| Authors: | ZHAO Fei GU Jiyou LI Xiaoping WENG Xiangli HUANG Yuanbo |
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| Abstract: | The development situation and the prospect of hot melt adhesives were introduced. And the polyblend theories related to preparation and modification of the hot melt adhesives were also elaborated. |
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| Keywords: | Hot melt adhesive Blending Thermodynamics IPN |
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