Microstructure,Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies |
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Authors: | Polina Snugovsky Heather McCormick Simin Bagheri Zohreh Bagheri Craig Hamilton Marianne Romansky |
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Affiliation: | (1) Celestica, 844 Don Mills Road, Toronto, ON, M3C 1V7, Canada |
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Abstract: | The results of an intensive reliability study on Pb-free ball grid array (BGA)/Sn-Pb solder assemblies as well as some lessons learnt dealing with mixed assembly production at Celestica are described in this paper. In the reliability study, four types of Pb-free ball grid array components were assembled on test vehicles using the Sn-Pb eutectic solder and typical Sn-Pb reflow profiles with 205°C to 220°C peak temperatures. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C. The influence of the microstructure on Weibull plot parameters and the failure mode will be shown. Interconnect defects such as nonuniform phase distribution, low-melting structure accumulation, and void formation are discussed. Recommendations on mixed assembly and rework parameters are given. |
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Keywords: | Pb-free components/Sn-Pb solder mixed assembly microstructure reliability backward compatibility |
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