Ion implantation studies on VOx films prepared by pulsed dc reactive sputtering

Vanadium oxide (VO_x) thin films find extensive use in room-temperature bolometers for IR imaging. It is desirable to control and modify the electronic properties of this temperature-sensitive material with treatments such as ion implantation and thermal annealing. In this work, we report on the modification of structural and electrical properties of VO_x thin films of varying compositions, deposited by pulsed dc reactive sputtering using a vanadium target under different oxygen flow rates. The as-deposited resistivities of the films ranged from 0.1 Ω cm to 100 Ω cm and the temperature coefficient of resistance (TCR) values varied from ?1.1% to ?2.7%. VO_x films used in microbolometers need to have a high TCR (>2%) and low resistivity values (1–10 Ω cm) in order to maximize sensitivity in conjunction with the read-out integrated circuit (ROIC). However, one usually finds a high TCR associated with high resistivity. Hence ion implantation followed by annealing was performed with the goal of improving the trade-off between TCR and resistivity. Two species – hydrogen (active) and helium (inert) – were chosen for implantation. Hydrogen is strongly electroactive and is well known for passivating defect states in a wide variety of electronic materials. As inert species, helium was chosen mainly to study the effects of bombardment on the film. The implanted films were annealed in an inert atmosphere to allow defect control and redistribution of atoms, and then characterized by current–voltage measurements over a wide temperature range. An order of magnitude change in resistance, and significant variations in TCR were observed. Further characterization has been done by X-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM) to correlate these resistivity changes with the structure of the films.