Reversal μCP using hard stamps |
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| Authors: | Iris Bergmair Michael Mühlberger Wolfgang Schwinger Kurt Hingerl Ernst Bernhard Kley Holger Schmidt Rainer Schöftner |
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| Affiliation: | 1. Profactor GmbH, Functional Surfaces and Nanostructures, Im Stadtgut A2, Steyr-Gleink 4407, Austria;2. Christian Doppler Laboratory for Surface Optics, Johannes Kepler University, Linz 4040, Austria;3. Friedrich Schiller University, Jena 07743, Germany;1. The Audit Department of Henan University, Kaifeng 475004, China;2. Key Lab for Special Functional Materials of Ministry of Education, Henan University, Kaifeng 475004, China;3. Quality and Technical Supervision, Inspection and Testing Center of Puyang, Puyang 457000, China;1. Unité Mixte de Physique CNRS/Thales, 1 avenue A. Fresnel, 91767 Palaiseau, France;2. Université Paris Sud, 91405 Orsay, France;3. Institut de Ciència de Materials de Barcelona, ICMAB-CSIC, Campus de la UAB, E-08193 Bellaterra, Spain;4. CNRS, Phynano Team, Laboratoire de Photonique et de Nanostructures, route de Nozay, 91460 Marcoussis, France;5. LPEM, CNRS-ESPCI, 10 rue Vauquelin, 75231 Paris, France;1. Northwestern University, Evanston, IL, United States;2. Department of Molecular Biophysics and Physiology, Rush University Medical Center, Chicago, IL, United States;1. Department of Science and Technology Centre on Biomolecular Electronics, Biomedical Instrumentation Section, CSIR-National Physical Laboratory, Dr. K. S. Krishnan Marg, New Delhi 110012, India;2. Centre for Interdisciplinary Research in Basic Sciences, Jamia Millia Islamia, New Delhi 110025, India;3. Department of Biotechnology, Delhi Technological University, Main Bawana Road, New Delhi 110042, India;4. Centre for NanoBioengineering & SpinTronics, Chungnam National University, 220 Gung-Dong, Yuseong-Gu, Daejeon 305-764, Korea |
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| Abstract: | In this work, we present a new method of Micro-Contact Printing (μCP) which we call reversal μCP using hard stamps which can be used for the fabrication of different structures like negative index materials, e.g., split ring resonators (SRRs), dots and squares made of gold. Typically soft stamps made of PDMS (polydimethylsiloxane) inked with thiols are used for μCP. The softness of the stamp material entails a lot of problems like deformation of the structures, sagging and pairing of the protruding features and reliability of the process. We use hard stamps which are spin coated with a thiol solution so that the thioles stay in the recessed areas of the stamp. In the following μCP process an EVG®620 is used to bring the stamp and substrate into contact so that the thiols on the stamp diffuse and bind to the gold surface and serve as an etch mask for succeeding wet chemical etching. Using this method overcomes the disadvantage of a soft stamp material. Smallest feature sizes down to 100 nm are shown. |
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