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Effect of grain boundary phase on the thermal conductivity of aluminium nitride ceramics |
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| Authors: | Ching -Fong Chen M E Perisse A F Ramirez N P Padture H M Chan |
| Affiliation: | (1) Keramont Corporation, 85714 Tucson, AZ, USA;(2) Lehigh University, 18015 Bethlehem, PA, USA;(3) Present address: Technical Ceramics Division, LECO Corporation, PO Box 211688, 30917 Augusta, GA, USA;(4) Present address: Saxonburg Ceramics Inc., 16056 Saxonburg, PA, USA;(5) Present address: MER Corp., 85706 Tucson, AZ, USA;(6) Present address: NIST, 20899 Gaithersburg, MD, USA |
| Abstract: | AIN with high thermal conductivity was fabricated by pressureless sintering with Y2O3 as the sintering aid. The thermal conductivity was observed to increase with sintering time (up to 8 h) at 1810 °C. The distribution of the sintering aid was identified as one of the major factors influencing the thermal conductivity in AIN. Non-uniform distribution of the grain boundary phase was found to be associated with a significant amount of porosity, resulting in the enhancement of phonon scattering and thereby lowering the thermal conductivity. |
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