Study on highly thermostable low-k polymer films based on fluorene-containing polyetherimides |
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Authors: | Marius Andrei Olariu Corneliu Hamciuc Mihai Asandulesa Elena Hamciuc Elena-Luiza Epure Violeta Tsakiris Gabriela Lisa |
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Affiliation: | 1. Electrical Engineering Faculty, Department of Electrical Measurements and Materials, “Gh. Asachi” Technical University, Iasi, Romania;2. “Petru Poni” Institute of Macromolecular Chemistry, Iasi, Romania;3. Faculty of Chemical Engineering and Environmental Protection “Cristofor Simionescu”, Department of Natural and Synthetic Polymers, “Gh. Asachi” Technical University of Iasi, Iasi, Romania;4. Department of Composite and Polymer Metallic Materials, INCDIE ICPE-CA, Bucharest, Romania;5. Faculty of Chemical Engineering and Environmental Protection “Cristofor Simionescu”, Department of Chemical Engineering, “Gh. Asachi” Technical University of Iasi, Iasi, Romania |
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Abstract: | Highly thermostable low-k polymer films with potential applications as dielectric materials in microelectronic industry were synthesized starting from 9,9-bis4-(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride and various diamines. A polyetherimide/silica nanocomposite film was obtained using methyltriethoxysilane as precursor of inorganic phase. The chemical structure was confirmed by FTIR and 1H NMR spectroscopy. Water vapor's sorption capacity, thermal stability, glass transition temperature, thermal diffusivity, specific heat, thermal conductivity, and dielectric characteristics of the films were determined. All the films exhibited excellent thermal stability, with an initial decomposition temperature in the range of 500–530°C. They showed low dielectric constant of 1.98–2.86 and low dielectric loss of 0.0037–0.011, at a frequency of 1 Hz and room temperature. The subglass γ- and β-relaxations, primary α-relaxation, and conductivity relaxation processes were discussed according to the chemical structure of the samples. Quantitative structure–property relationship (QSPR) study was conducted, and linear regression models were formulated to describe the causal relationships between different parameters and polyetherimide properties. |
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Keywords: | dielectric properties fluorene groups polyetherimides QSPR study thermal characteristics |
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