| 金刚石/铜复合材料在电子封装材料领域的研究进展 |
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| 引用本文： | 邓安强,樊静波,谭占秋,范根莲,李志强,张荻. 金刚石/铜复合材料在电子封装材料领域的研究进展[J]. 金刚石与磨料磨具工程, 2010, 30(5): 56-61. DOI: 10.3969/j.issn.1006-852X.2010.05.012 |
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| 作者姓名： | 邓安强 樊静波 谭占秋 范根莲 李志强 张荻 |
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| 作者单位： | [1]宁夏大学机械工程学院,银川750021 [2]上海交通大学金属基复合材料国家重点实验室,上海200240 |
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| 基金项目： | 宁夏自然科学基金，国家民委粉体材料与特种陶瓷重点实验室开放基金 |
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| 摘 要： | 金刚石/铜复合材料作为新型电子封装材料受到了广泛的关注。综述了金刚石/铜复合材料作为电子封装材料的国内外研究现状,介绍了金刚石/铜复合材料的制备工艺,并从材料科学的原理综述了该复合材料主要性能指标（热导率）的影响因素,同时对金刚石/铜复合材料的界面问题进行了分析,最后对金刚石/铜复合材料的未来应用进行了展望。
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| 关 键 词： | 金刚石/铜 复合材料 电子封装 热导率 界面 |
Research progress of diamond/Cu composite material for electronic packaging |
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| Deng Anqiang,Fan Jingbo,Tan Zhanqiu,Fan Genlian,Li Zhiqiang,Zhang Di. Research progress of diamond/Cu composite material for electronic packaging[J]. Diamond & Abrasives Engineering, 2010, 30(5): 56-61. DOI: 10.3969/j.issn.1006-852X.2010.05.012 |
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| Authors: | Deng Anqiang Fan Jingbo Tan Zhanqiu Fan Genlian Li Zhiqiang Zhang Di |
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| Affiliation: | Deng Anqiang Fan Jingbo Tan Zhanqiu Fan Genlian Li Zhiqiang Zhang Di(1.College of Mechanical Engineering,Ningxia University,Yinchuan 750021,China)(2.State Key Laboratory of Metal Matrix Composites,Shanghai Jiaotong University,Shanghai 200240,China) |
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| Abstract: | Diamond/copper composites as a new generation of electronic packaging material have attracted more and more attention.This paper overviews the research conditions and manufacturing process for electronic packaging materials of diamond/copper composites in China and abroad.The thermal conductivity of diamond/ copper composites and its influencing factors were introduced based on the principles of materials science.At the same time,the interface problem of diamond/copper composites was analyzed,finally the future application of diamond/copper composites was described. |
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| Keywords: | diamond/copper composites electronic packaging thermal conductivity interface |
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