| Ni对Sn96.5Ag3.5/Cu之间扩散行为的阻挡作用 |
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| 引用本文： | 朱奇农,罗乐,肖克,杜黎光.Ni对Sn96.5Ag3.5/Cu之间扩散行为的阻挡作用[J].中国有色金属学报,2000,10(2):199-202. |
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| 作者姓名： | 朱奇农 罗乐 肖克 杜黎光 |
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| 作者单位： | 中国科学院上海冶金研究所!上海200050 |
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| 摘 要： | 研究了电镀Ｎｉ层和化学镀Ｎｉ－Ｐ合金层对Ｓｎ－Ａｇ／Ｃｕ焊点扩散行为的影响，电子探针分析表明，化学镀Ｎｉ－Ｐ合金层能很好地阻止Ｓｎ－Ａｇ／Ｃｕ焊点在焊接过程中的ＣｕＳｎ互扩散和相互反应；而电镀Ｎｉ层则不能阻止Ｓｎ－Ａｇ／Ｃｕ焊点过程中的Ｃｕ，Ｓｎ互搁工用和相互反应，界面反应产物以Ｃｕ６Ｓｎ５为主。应用化学镀Ｎｉ－Ｐ合金作为Ｓｎ－Ａｇ／Ｃｕ之间的扩散阻挡层可大大减少Ｓｎ／Ｃｕ金属间化合物的生成，有得
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| 关 键 词： | 扩散 电子器件封装 镍镀层 金属间化合物 钎焊 |
| 修稿时间： | 1999-06-07 |
Ni as diffusion barriers between eutectic Sn Ag solder and Cu |
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| ZHU Qi nong,LUO Le,XIAO Ke,DU Li guang.Ni as diffusion barriers between eutectic Sn Ag solder and Cu[J].The Chinese Journal of Nonferrous Metals,2000,10(2):199-202. |
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| Authors: | ZHU Qi nong LUO Le XIAO Ke DU Li guang |
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| Affiliation: | ZHU Qi nong,LUO Le,XIAO Ke,DU Li guang Shanghai Institute of Metallurgy,Chinese Academy of Sciences,Shanghai 200050,P.R.China |
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| Abstract: | The effects of electroplated Ni layer and electroless plated Ni P layer on the diffusion behavior in Sn Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni P layer acted as a good diffusion barrier between Sn Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter diffusion and reaction between molten Sn Ag solder and Cu substrate when reflowing, and there was a layer of IMC ( Cu 6Sn 5) at interface of Sn Ag/Cu solder joint. Electrolessly plated Ni P layer can obviously decrease the generation of Sn Cu IMC at the interface of Sn Ag/Cu, which is beneficial to improve the reliability of solder joint. |
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| Keywords: | diffusion electronic packing nickel-plated layer intermetallic compounds |
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