| 微波LNA高可靠组装工艺 |
| |
| 引用本文： | 陆吟泉,陈昊,徐榕青.微波LNA高可靠组装工艺[J].电子工艺技术,2007,28(5):280-282,289. |
| |
| 作者姓名： | 陆吟泉 陈昊 徐榕青 |
| |
| 作者单位： | 中国电子集团公司第二十九研究所,四川,成都,610036;中国电子集团公司第二十九研究所,四川,成都,610036;中国电子集团公司第二十九研究所,四川,成都,610036 |
| |
| 摘 要： | 讨论了微波低噪声放大器(LNA)气密性封装、水气含量控制、高可靠性组装等集成工艺技术.分析了腔体、盖板的尺寸配合以及质量因素对气密性封装的影响;讨论了材料控制、元器件选择、氮气系统对水气含量的影响;阐述了在组装工艺中,如共晶、小焊盘键合等关键工艺技术.通过此方法研制的低噪声放大器满足性能指标及环境试验要求.
|
| 关 键 词： | 微波LNA 微组装 高可靠 工艺 |
| 文章编号： | 1001-3474（2007）05-0280-04 |
| 修稿时间： | 2007-07-16 |
High Reliability Assembly Technologies of Microwave LNA |
| |
| LU Yin-quan,CHEN Hao,XU Rong-qing.High Reliability Assembly Technologies of Microwave LNA[J].Electronics Process Technology,2007,28(5):280-282,289. |
| |
| Authors: | LU Yin-quan CHEN Hao XU Rong-qing |
| |
| Affiliation: | CETC No. 29 Research Institute,Chengdu 610036 ,China |
| |
| Abstract: | Encapsulation,controlling of moisture content and high reliability assembly technologies of microwave low noise amplifier(LNA)are discussed.The influence of the encapsulation due to quality and dimension of the box and lid are analyzed,and the influence of the moisture content based on material controlling,devices choosing and nitrogen system are discussed,as well as the key technologies in high reliability assembly including eutectic,small pad bonding are interpreted.The LNA manufactured by the methods have met the technical requirements,the researched LNA can pass the particular environment stress screen tests. |
| |
| Keywords: | Microwave LNA Micro - assembly High reliability Technologies |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
