| Ag-28Cu钎焊TiNiSMA接头的微观组织特征 |
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| 引用本文： | 唐家伟,谢淑兰,赵兴科.Ag-28Cu钎焊TiNiSMA接头的微观组织特征[J].热喷涂技术,2010(4):67-72. |
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| 作者姓名： | 唐家伟 谢淑兰 赵兴科 |
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| 作者单位： | 北京矿冶研究总院;北京科技大学; |
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| 摘 要： | 为充分发挥SMA的高阻尼特性,制作高性能的新型阻尼器,本文开展了TiNiSMA的钎焊制备及其性能研究。研究结果表明:焊接接头的界面组织主要为a-Ti+Ti2Cu(TiCu2及Ti(Ni,Cu))+Ag一次固溶体+Ag-Cu共晶。随着钎焊温度的不断升高,焊缝尺寸不断减小。钎焊温度为870℃时,连接层与母材界面以小型锯齿状结合,而生成的Ti2Cu相对形状记忆效应有利,组织致密。
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| 关 键 词： | SMA 钎焊 界面组织 Ag-28Cu钎料 |
Study on Microstructural Characteristics of TiNi SMA Joint of Brazed by Ag-28Cu |
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| TANG Jia-wei,XIE Shu-lan,ZHAO Xing-ke.Study on Microstructural Characteristics of TiNi SMA Joint of Brazed by Ag-28Cu[J].Thermal Spray Technology,2010(4):67-72. |
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| Authors: | TANG Jia-wei XIE Shu-lan ZHAO Xing-ke |
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| Affiliation: | TANG Jia-wei1,XIE Shu-lan1,ZHAO Xing-ke2 (1.Beijing General Research Institute of Mining & Metallurgy,Beijing 100044,China,2.University of Science & Technology Beijing,Beijing 100083,China) |
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| Abstract: | In order to fabricate novel damper with outstanding performance to exert the high damping capacity of shape memory alloy （SMA）, the properties of TiNi SMA prepared by brazing were investigated in this article. The results indicate that interface microstructure of brazed joints is a-Ti＋Ti2Cu（TiCu2 及 Ti（Ni, Cu））＋Ag solid solution＋ Ag-Cu eutectic. As the temperature of braze welding is higher, the dimension of welding is minished, gradually. The connection layer and base material were combined with miniature indention.TizCu of interface microstructure was of advantage to shape memory effect, and the interface microstructure was dense structure. |
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| Keywords: | SMA Brazing Interface microstructure Ag-28Cu brazing filler |
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