A new removable resist for high aspect ratio applications |
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Authors: | Matthias Schirmer Doris Perseke Eva Zena Daniel Schondelmaier Ivo Rudolph Bernd Loechel |
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Affiliation: | (1) Allresist GmbH, Am Biotop 14, 15344 Strausberg, Germany;(2) BESSY GmbH, Application Center for Micro Engineering, Albert-Einstein Strasse 15, 12489 Berlin, Germany |
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Abstract: | A variety of different photo resists are used for fabrication of MEMS. Presently good results were reported for SU-8, a chemically
amplified negative tone photoresist. But SU-8 has a disadvantage for some applications in LIGA technique, especially in the
X-ray mask fabrication. After processing the finished resist pattern are hardly soluble from the substrate. This paper will
briefly describe the current status of the development of the new negative tone photoresist CAR 44 whose big advantage is
the easy removableness of the cross linked pattern.
This work widely uses the contents of the presentation “A New Removable Resist for High Aspect Ratio Applications” to the
High Aspect Ratio Micro Structure Technology workshop HARMST 2005 held in Gyeongyu (Republic of Korea), June 10–13, 2005. |
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