Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon

high-strength Si₃N₄with elongated β-Si₃N₄ and equiaxed α-sialon was tested in cyclic and static fatigue at 1400°C. At low stress intensity factors and high frequencies, the pullout process of the elongated grains was enhanced, which suppressed the crack growth. This provides a possible explanation for the increased lifetime under cyclic leading conditions reported for ceramics by several investigators. While crack-healing by high-temperature annealing was found to greatly reduce the subsequent static fatigue crack growth rate, it had only a modest effecf on cyclic fatigue and none at high frequencies.