Deposition Behavior of Copper Fine Particles onto Flat Substrate Surface in Cold Spraying

Cold spray is a promising process to fabricate high-quality metallic coatings. However, it is necessary to improve some properties, especially the adhesive strength of the coating to the substrate to clarify deposition mechanism of the solid particles onto substrate surface. In this study, deposition behavior of the cold sprayed copper fine particles was observed precisely and the adhesive strength of the coating was evaluated. The deposition behavior of the sprayed individual copper particles on mirror polished stainless steel substrate was fundamentally investigated. The interface microstructure between sprayed particle and substrate revealed that an amorphous-like band region was recognized at interface during coating fabrication at high power conditions. For the deposition mechanism of the cold sprayed particles onto substrate surface, it was indicated that the deformation of the particles initially induce the destruction of its surface oxide and an appearance of the active fresh surface of the material may enhance the bonding between particles and substrate. On the other hand, in coating fabrication at high power condition, bonding between particle and substrate may be possibly formed via oxygen-rich amorphous-like layer at interface.