| 投影光刻机在先进封装中的应用 |
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| 引用本文： | 周畅,贺荣明. 投影光刻机在先进封装中的应用[J]. 电子工业专用设备, 2010, 39(3): 47-50 |
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| 作者姓名： | 周畅 贺荣明 |
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| 作者单位： | 上海微电子装备有限公司,上海,201203 |
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| 摘 要： | 随着先进封装技术的发展,对光刻的要求(CD均匀性、套刻精度等)将逐渐提高,当硅片尺寸逐渐增大到200mm(8英寸)乃至.300mm(12英寸)时,步进投影式光刻机在全片一致性上的优势更明显。SS B500系列先进封装步进投影式光刻机具备良好的RDL、Bump等工艺适应性,分析了CD及套刻的影响因素,阐述了绝对套刻测量的意义,并以实测数据表明SSB500/10A已实现良好的整机性能。
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| 关 键 词： | 先进封装 投影光刻机 关键尺寸(CD) 套刻 |
Application of Stepper in Advanced Package |
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| ZHOU Chang,HE Rongming. Application of Stepper in Advanced Package[J]. Equipment for Electronic Products Marufacturing, 2010, 39(3): 47-50 |
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| Authors: | ZHOU Chang HE Rongming |
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| Affiliation: | Shanghai Micro Electronics Equipment CO.;LTD. Shang hai 201203;China |
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| Abstract: | With development of advanced package technology,requirements for lithographic process become tighter than before. When dealing with 8 or 12 inch wafer,stepper shows better uniformity of CD and overlay in a wafer or a batch. Stepper of SS B500 serial can be used in RDL and Bump process. This paper analyses factors impacting CD and overlay,proposes absolute overlay error concept. And also shows good performance by testing data of equipment. |
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| Keywords: | Advanced Package Stepper CD Overlay |
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