次亚磷酸钠作还原剂化学镀铜工艺研究

近年来,化学镀铜技术在PCB行业、机械工业、航空航天等各行业有着越来越广泛的应用,有关化学镀铜的机理研究和工艺路线改进等课题已成为当今材料表面处理研究领域的热点之一。然而,以甲醛为还原剂的传统化学镀铜工艺受绿色制造的要求,其使用将受到限制,开发非甲醛体系化学镀具有巨大市场潜力。本文采用RF-4环氧树脂为基材,研究了以次亚磷酸钠为还原剂的化学镀铜工艺的改进,并且讨论了添加剂的加入对镀铜层形貌和性能的影响。

Research on electroless copper plating technology using Hypophosphite as reducing agent

In recent years, the electroless copper is more and more extensive applied in several fields including PCB industry, mechanical industry, aerospace, etc. The investigation on the mechanism of electroless copper plating and process improvement has become one of the most interesting topics on research part of material surface treatment. However, the traditional electroless copper platting which used formaldehyde as reducing agent would be restricted for the request of green produce in the future. The Research...