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GaAs亚微米自对准工艺技术研究
引用本文:陈克金,顾炯.GaAs亚微米自对准工艺技术研究[J].固体电子学研究与进展,1994,14(2):161-167.
作者姓名:陈克金  顾炯
作者单位:南京电子器件研究所
摘    要:总结了在50mmGaAs圆片上实现自对准介质膜隔离等平面工艺技术的研究,着重描述了离子注入、自对准亚微米难熔栅制备、钝化介质膜生长、干法刻蚀、电阻和电容制备等关键工艺的研究结果。这套工艺的均匀性、重复性好,在50mmGaAs圆片上获得了满意的成品率。采用这套工艺已成功地研制出多种性能良好的GaAsIC和GaAs功率MESFET,证明国家自然科学基金委员会这一重大课题的选择对发展我国GaAsIC确实具有重大意义。

关 键 词:自对准,离子注入,平面工艺,GaAs圆片

A GaAs Submicron Self-aligned Fabrication Technology
Chen Kejin, Gu Jiong, Sheng Wenwei, Mao kunchun, Lin Jinting.A GaAs Submicron Self-aligned Fabrication Technology[J].Research & Progress of Solid State Electronics,1994,14(2):161-167.
Authors:Chen Kejin  Gu Jiong  Sheng Wenwei  Mao kunchun  Lin Jinting
Abstract:A fabrication technology of planar self-aligned fully ion implantation on 50 mm GaAs wafers is described in this paper. The research achievements of some key processings, including ion implantation, self-aligned refractory gate, PECVD passivation film, dry etching,planar resistor and MIM capacitor are especially given. A satisfying yield on 50 mm GaAs wafers was obtained due to the high uniformity and reproducibility. Using this technology,we have fabricated several kinds of GaAs ICs and GaAs power MESFETs with good performance. This proves that the selection of the subject has an important meaning for the development of the GaAs iC in our country.
Keywords:Self-aligned  Ion implantation  Planar Technology  GaAs Wafers  
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