| 铜颗粒增强对锡铅钎料蠕变寿命的影响 |
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| 引用本文： | 闫焉服,刘建萍,史耀武,夏志东,周国峰. 铜颗粒增强对锡铅钎料蠕变寿命的影响[J]. 电子工艺技术, 2004, 25(1): 20-22 |
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| 作者姓名： | 闫焉服 刘建萍 史耀武 夏志东 周国峰 |
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| 作者单位： | 北京工业大学新型功能材料教育部重点实验室,北京,100022 |
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| 摘 要： | 颗粒增强是提高合金性能的重要手段之一.增强体的不同含量对基体的性能会产生不同的影响.主要分析和讨论了铜的不同含量对铜颗粒增强的锡铅基复合钎料蠕变性能的影响.测定6种铜颗粒增强的锡铅基复合钎料的蠕变寿命.试验结果表明:在相同的条件下,复合钎料的蠕变寿命与锡铅钎料相比,均有不同程度的提高.当铜的质量分数约为1%时,复合钎料的蠕变性能最好,约为锡铅钎料的17倍.
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| 关 键 词： | 蠕变寿命 复合钎料 颗粒增强 |
| 文章编号： | 1001-3474(2004)01-0020-03 |
| 修稿时间： | 2002-08-20 |
Effect of Enhanced Particles Cu on Creep Rupture Life of SnPb Based Composite Solder |
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| YAN Yan - Fu,LIU Jian - ping,Sffl Yao - wu,XIA Zhi - dong,ZHOU Guo - feng. Effect of Enhanced Particles Cu on Creep Rupture Life of SnPb Based Composite Solder[J]. Electronics Process Technology, 2004, 25(1): 20-22 |
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| Authors: | YAN Yan - Fu LIU Jian - ping Sffl Yao - wu XIA Zhi - dong ZHOU Guo - feng |
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| Abstract: | Particle - enhance is the way to improve the property of solder alloy. The content of enhanced particles has different effect on the matrix solder. The influence of enhanced particles Cu on the rupture life of 63Sn-37Pb eutectic solder with containing Cu of 0.5 % to 15 % was investigated.lt is indicated that the creep rupture lives of the composite solders were more than that of 63Sn - 37Pb eutectic solder at the same condition. When Cu is about 1 % ,the creep rupture life of the composite solder is longest, about 17 times of that of 63Sn-37Pb solder. |
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| Keywords: | Creep rupture life Composite solder Particle- enhance |
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