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复合电沉积铜-钨合金工艺及其机理的研究
引用本文:李远会,张晓燕,李广宇,黄碧芳.复合电沉积铜-钨合金工艺及其机理的研究[J].电镀与环保,2010,30(1):19-22.
作者姓名:李远会  张晓燕  李广宇  黄碧芳
作者单位:贵州大学材料与冶金学院,贵州,贵阳,550003;贵州大学材料与冶金学院,贵州,贵阳,550003;贵州大学材料与冶金学院,贵州,贵阳,550003;贵州大学材料与冶金学院,贵州,贵阳,550003
基金项目:贵州省科技厅工业攻关项目Z083076[2008]3030;;贵州大学青年基金项目X082030[2007]030
摘    要:分析了阴极电流密度、微粒的质量浓度、温度、搅拌速率等对铜-钨复合镀层中钨微粒的体积分数的影响。用扫描电镜观察正交优化工艺制备的复合镀层,结果表明:镀层电沉积结晶均匀、细致。此外,对复合电沉积铜-钨的过程机理进行了初步探讨,结果表明:在低电流密度条件下,铜-钨复合镀层的沉积遵循Guglielmi模型机理。

关 键 词:铜-钨复合镀层  电沉积  工艺  机理

A Study of Cu-W Composite Electrodeposition Process and Its Mechanism
LI Yuan-hui,ZHANG Xiao-yan,LI Guang-yu,HUANG Bi-fang.A Study of Cu-W Composite Electrodeposition Process and Its Mechanism[J].Electroplating & Pollution Control,2010,30(1):19-22.
Authors:LI Yuan-hui  ZHANG Xiao-yan  LI Guang-yu  HUANG Bi-fang
Affiliation:Faculty of Materials and Metallurgy;Guizhou University;Guiyang 550003;China
Abstract:The effects of cathode current density,mass concentration of suspended W powders,temperature,stirring intensity on the volume fraction of W particles in the Cu-W composite coating were studied.The results of SEM analysis show that the crystallization of the electrodeposited composite coating prepared with orthogonal optimized technology is homogeneous and compact.In addition,the mechanism of the composite electrodeposition was preliminary investigated.The results show that Guglielmi's model mechanism is fol...
Keywords:Cu-W composite coating  electrodeposition  process  mechanism  
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