| 铝表面SiOx薄膜结合性能与机理研究 |
| |
| 引用本文： | 张际亮,郦剑,沃银花,王幼文,甘正浩. 铝表面SiOx薄膜结合性能与机理研究[J]. 材料热处理学报, 2006, 27(1): 68-70 |
| |
| 作者姓名： | 张际亮 郦剑 沃银花 王幼文 甘正浩 |
| |
| 作者单位： | 1. 浙江大学材料系,浙江,杭州,310027
2. 新加坡南洋理工大学电气工程系,新加坡,639798 |
| |
| 摘 要： | 应用化学气相沉积（CVD）方法在铝表面形成SiOx陶瓷涂层，通过弯曲实验研究了涂层与基体的结合性能。利用扫描电子显微镜（SEM）观察了弯曲部位的表面形貌，弯曲过程表述为表面凹坑与内部孔洞联合长大，形成长条裂纹状沟槽或突脊，最后裂纹长大直至断裂。研究表明，基底与膜层结合良好，形成高结合力的原因是铝基底与表面SiOx膜层间过渡层中的Al-O与Si-O键合能很高，键合稳定。
|
| 关 键 词： | 铝基 SiOx薄膜 弯曲实验 结合力 机理 |
| 文章编号： | 1009-6264（2006）01-0068-03 |
| 收稿时间： | 2005-05-09 |
| 修稿时间： | 2005-05-092005-06-24 |
Bending test and bonding mechanism analysis of the SiOx film on aluminum substrate |
| |
| ZHANG Ji-liang,LI Jian,WO Yin-hua,WANG You-wen,GAN Zheng-hao. Bending test and bonding mechanism analysis of the SiOx film on aluminum substrate[J]. Transactions of Materials and Heat Treatment, 2006, 27(1): 68-70 |
| |
| Authors: | ZHANG Ji-liang LI Jian WO Yin-hua WANG You-wen GAN Zheng-hao |
| |
| Abstract: | A kind of SiO_X film was deposited on aluminum substrate by ambient pressure chemical vapor deposition. The bonding properties were studied by 90 and 180 degrees multi-bending tests. The morphology of the bended surface by scanning electrical microscopy shows that the film is bonded well to the substrate. The fracture process is described as follows: the surface pits and inner vacancies grow and link up to a lot of grooves or ridges,causing breaking down. The results show that there is transition layer in which the bonding energy of Al-O and Si-O is high enough to binding the substrate and surface showing an excellent bonding strength. |
| |
| Keywords: | aluminum SiO_X film multi-bending test bonding properties mechanism |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
