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Studying the thermoviscoelastic response of the Redux 312 adhesive—Part 2: Modeling
Authors:A DeheegerJD Mathias  M Grédiac
Affiliation:a Clermont Université, Université Blaise Pascal, EA 3867, Laboratoire de Mécanique et Ingénieries, BP 10448, 63000 Clermont-Ferrand, France
b Laboratoire d'Ingénierie pour les Systèmes Complexes, CEMAGREF, Campus des Cézeaux, 24 avenue des Landais, BP 50085, 63172 Aubière Cedex, France
Abstract:The aim of this work is to propose a numerical model of a bonded joint that takes into account the thermoviscoelastic response of the adhesive to compute the stress distribution in the adhesive as well as in the adherends. The adhesive is assumed to obey a generalized Maxwell model. The effect of temperature is taken into account by considering that the branches of the model change with temperature. The numerical solution is obtained iteratively. The particular case of the Redux 312 adhesive is then considered as an example. The procedure is applied in various cases exhibiting an increasing complexity. Some significant differences are observed with the usual solution obtained within the framework of elasticity if the effects of both temperature and time are taken into account.
Keywords:Bonded joint  thermoviscoelasticity  Modeling  Adhesive
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