雷达制导部件高热流密度组件散热技术

随着军用电子器件和微波器件的发展,高功率密度器件在军用电子装备上得到更为广泛的应用。军用电子装备的功率密度越来越大,对散热技术的要求也越来越高。文中针对弹载雷达高热流密度组件的散热问题,论述了一种基于均温板的强迫液冷散热方法,并对设计分别进行了120 s时瞬态分析和稳态分析。分析结果表明,高热流密度芯片能够正常工作,可以保证弹载雷达制导部件的工作要求和连续性测试需求。

Heat Dissipation Technology of High Heat Flux Components on Radar Guidance Assembly

With the development of military electronic device and microwave device, high power density device is more widely used in military electronic equipment. The power density of these devices is getting higher and higher, therefore the demands of heat dissipation increase. The article discusses a forced liquid-cooling heat dissipation technology based on vapor chamber for high heat flux components of missile-borne radar. Transient temperature distribution at 120 s and steady temperature distribution of the thermal model are simulated. Analysis result shows that the high heat flux chips could work well. The working condition requirements and the uninterrupted test requirements of the radar guidance assembly can be guaranteed.