| 挠性PCB用基板材料的新发展（5）——FPC用电解铜箔的新成果 |
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| 引用本文： | 祝大同.挠性PCB用基板材料的新发展（5）——FPC用电解铜箔的新成果[J].印制电路信息,2005(6):7-12,16. |
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| 作者姓名： | 祝大同 |
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| 摘 要： | 主要阐述FPC用挠性覆铜板2003年￣2004年在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。
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| 关 键 词： | 挠性印制电路板 挠性覆铜板 电解铜箔 |
The Newest Progress of Base Material Used in Flexible PCB (5)--Review and Characteristic of Development about FCCL |
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| Zhu Datong.The Newest Progress of Base Material Used in Flexible PCB (5)--Review and Characteristic of Development about FCCL[J].Printed Circuit Information,2005(6):7-12,16. |
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| Authors: | Zhu Datong |
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| Abstract: | In the paper, the manufacturer and the base material including PI film and copper foil in FPC werereviewed from 2003 to 2004. At the same, the development of technology and product was introduced. |
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| Keywords: | flexible printed circuit board (FPC) flexible copper clad laminate(FCCL)electro deposited copper foil(ED) |
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