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Effect of interfacial friction force on material removal in full aperture continuous polishing process
Affiliation:1. Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China;2. Key Laboratory for Particle Astrophysics, Institute of High Energy Physics, Chinese Academy of Sciences (CAS), Beijing, 100049, China;1. Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;2. Ningbo Institute of Dalian University of Technology, Dalian University of Technology, Ningbo 315000, China;3. Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics, Mianyang 621999, China;1. State Key Laboratory of Precision Measuring Technology & Instruments, Laboratory of Micro/Nano Manufacturing Technology, Tianjin University, Tianjin 300072, China;2. Centre of Micro/Nano Manufacturing Technology (MNMT-Dublin), University College Dublin, Dublin, Ireland
Abstract:Full aperture continuous polishing using pitch lap is a key process of finishing large flat optical workpiece. The friction force of the workpiece and pitch lap interface significantly affects material removal. In this work, the friction force was determined by a measurement system that uses force transducers to support the workpiece. Experimental and theoretical analyses have been carried out to investigate the evolution of friction force with polishing time and its effect on material removal. Our results show that the friction coefficient of the workpiece/lap interface decreases during polishing, which is due to surface smoothing of the viscoelastic pitch lap by loading conditioner. In addition, the spatial average and uniformity of material removal rate (removal coefficient) increases with the increase of friction coefficient, which is due to rough lap surface, provides more sharp asperities to charge the polishing particles.
Keywords:Continuous polishing  Friction force  Material removal
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