| Effect of the Fourth Element on Bonding of Silicon Nitride Ceramics with Y_2O_3-Al_2O_3-SiO_2 Glass Solders |
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| 引用本文： | 周飞. Effect of the Fourth Element on Bonding of Silicon Nitride Ceramics with Y_2O_3-Al_2O_3-SiO_2 Glass Solders[J]. 中国稀土学报(英文版), 2001, 0(2) |
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| 作者姓名： | 周飞 |
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| 摘 要： | Ｂｏｎｄｉｎｇｏｆｓｉｌｉｃｏｎｎｉｔｒｉｄｅｃｅｒａｍｉｃｓｗｉｔｈｏｘｉｄｅｇｌａｓｓｓｏｌｄｅｒｈａｓｂｅｅｎａｃｈｉｅｖｅｄｖｅｒｙｇｒｅａｔｓｕｃｃｅｓｓ[1～ 11] .Ｏｗｉｎｇｔｏｔｈｅｌｏｗｅｒｓｏｆｔｅｎｉｎｇｔｅｍｐｅｒａｔｕｒｅｏｆｒｅｓｉｄｕａｌｇｌａｓｓｉｎｊｏｉｎｔ ,ｔｈｅｈｉｇｈｔｅｍｐｅｒａｔｕｒｅｓｔｒｅｎｇｔｈｏｆｊｏｉｎｔｈａｓｂｅｅｎｄｅｔｅｒｉｏ ｒａｔｅｄ .Ｉｎｏｒｄｅｒｔｏｉｍｐｒｏｖｅｔｈｅｊｏｉｎｔｓｔｒｅｎｇｔｈａｔｅｌｅｖａｔｅｄｔｅｍｐｅｒａｔｕ…
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Effect of the Fourth Element on Bonding of Silicon Nitride Ceramics with Y_2O_3-Al_2O_3-SiO_2 Glass Solders |
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| ZHOU Fei. Effect of the Fourth Element on Bonding of Silicon Nitride Ceramics with Y_2O_3-Al_2O_3-SiO_2 Glass Solders[J]. Journal of Rare Earths, 2001, 0(2) |
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| Authors: | ZHOU Fei |
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| Abstract: | Bonding of Si 3N 4 ceramic was performed with Y 2O 3 Al 2O 3 SiO 2(YAS) X glass solders,which were mixed with TiO 2 (YT) and Si 3N 4 (YN), respectively. The effects of bonding conditions and interfacial reaction on the joint strength were studied. The joint strength in different bonding conditions was measured by four point bending tests. The interfacial microstructures were observed and analyzed by SEM, EPMA and XRD. It is shown that with the increase of bonding temperature and holding time, the joint strength increases reaching a peak, and then decreases. When TiO 2 is put into YAS solder,the bonding interface with Si 3N 4/(Y Sialon glass TiN)/TiN/Y Sialon glass is formed. When YAS solder is mixed with Si 3N 4 powder, the interfacial residual thermal stress may be decreased, and then the joint strength is enhanced. According to microanalyses, the bonding strength is related to interfacial reaction. |
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| Keywords: | rare earths Si 3N 4 ceramic yttria titanium oxide oxynitride glass bonding |
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