| VLSI塑料封装失效分析与控制方法研究 |
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| 引用本文： | 焦慧芳,贾新章,王群勇. VLSI塑料封装失效分析与控制方法研究[J]. 固体电子学研究与进展, 2005, 25(4): 564-568 |
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| 作者姓名： | 焦慧芳 贾新章 王群勇 |
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| 作者单位： | 西安电子科技大学微电子所,西安,710071;信息产业部电子五所,广州,510610;西安电子科技大学微电子所,西安,710071;信息产业部电子五所,广州,510610 |
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| 摘 要： | 塑封VLSI由于其固有的弱点,在应用过程中封装失效成为其重要的失效模式之一。通过大量的塑封VLSI失效分析实践,针对VLSI塑料封装失效,进行了快速定位技术的研究,总结出一套简化的失效分析程序。同时从引起塑封VLSI封装失效的根本原因入手,探讨了避免塑封VLSI封装失效的控制方法。
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| 关 键 词： | 塑封超大规模集成电路 封装失效 失效分析与控制 |
| 文章编号： | 1000-3819(2005)04-564-05 |
| 修稿时间： | 2004-06-07 |
The Technique for Failure Analysis and Control of Plastic Encapsulated VLSI |
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| JIAO Huifang,JIA Xinzhang,WANG Qunyong. The Technique for Failure Analysis and Control of Plastic Encapsulated VLSI[J]. Research & Progress of Solid State Electronics, 2005, 25(4): 564-568 |
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| Authors: | JIAO Huifang JIA Xinzhang WANG Qunyong |
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| Abstract: | Because of its inherent weakness, the package failure of plastic encapsulated VLSI becomes one of the most important failure mode during its engineering application. This paper studies the fast failure localization technique and presents a simplified process of failure analysis which focuses on the package failure of plastic encapsulated VLSI based on a lot of practical failure analysis. Finally the control method for avoiding plastic package failure is discussed according to the root cause of package failures of the plastic VLSI. |
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| Keywords: | plastic encapsulated VLSI package failure failure analysis and failure control |
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