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直接冷却中氮化铝与无氧铜低温真空接触热导的实验研究
引用本文:王建,王惠龄,陈进,庄汉锐. 直接冷却中氮化铝与无氧铜低温真空接触热导的实验研究[J]. 低温工程, 2006, 0(2): 30-34
作者姓名:王建  王惠龄  陈进  庄汉锐
作者单位:华中科技大学能源与动力工程学院,武汉,430074;中国科学院上海硅酸盐研究所,上海,200050
基金项目:国家自然科学基金(51076013)资助项目.
摘    要:以5W/20K小型G-M制冷机为冷源,对低温下氮化铝(AlN)与无氧铜(OFHC)界面的接触热导进行了实验研究和分析。在45~140K内,氮化铝/无氧铜界面接触热导随温度的升高而增大,同时亦随接触压力的增加而增大。实验中同时得到了氮化铝在低温下的热导率,随温度的升高,氮化铝热导率值逐渐增大。就氮化铝低温热导率及氮化铝/无氧铜接触界面热阻随温度变化规律进行了微结构机理分析。

关 键 词:低温界面热导  声子导热  高温超导应用  制冷机直接冷却  实验研究
文章编号:1000-6516(2006)02-0030-05
收稿时间:2005-10-16
修稿时间:2005-10-162006-03-02

Thermal contact conductance of ceramic AlN and OFHC interfaces under low temperature and vacuum for HTS cryocooler cooling
Wang Jian,Wang Huiling,Chen Jin,Zhuang Hanrui. Thermal contact conductance of ceramic AlN and OFHC interfaces under low temperature and vacuum for HTS cryocooler cooling[J]. Cryogenics, 2006, 0(2): 30-34
Authors:Wang Jian  Wang Huiling  Chen Jin  Zhuang Hanrui
Affiliation:1 Laboratory of Cryogenics, Huazhong University of Science and Technology,Wuhan 430074, China; 2 Shanghai Institute of Ceramics, Chinese Academy of Science, Shanghai 200050, China
Abstract:The thermal conductivity of ceramic AlN and the thermal contact conductance(TCC)between AlN and OFHC under the low temperature(45~140 K)and the vacuum(10~(-3)~10~(-4) Pa)had been measured using the axial steady heat flow method on the G-M cryocooler with 5 W/20 K capacity.Investigation shows that the TCC of AlN/Cu interface increases as the contact temperature and pressure increase,and the conductivity of ceramic AlN increases as the temperature rises.An analysis based on micro and nano structural cryogenic concept was made for explaining the change of thermal conductivity of AlN and the thermal contact conductance of AlN/Cu interface.
Keywords:thermal contact conductance   phonon thermal conduction   high Tc superconducting application    cryocooler cooling   experimental investigation
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