| SnAgCu无铅钎料焊点结晶裂纹 |
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| 引用本文： | 董文兴,史耀武,夏志东,雷永平,郭福,李晓延.SnAgCu无铅钎料焊点结晶裂纹[J].焊接学报,2008,29(12):61-63,68. |
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| 作者姓名： | 董文兴 史耀武 夏志东 雷永平 郭福 李晓延 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124 |
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| 基金项目： | 十一五国家科技支撑重点项目"含有毒有害材料元素材料替代技术
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北京市属市管高等学校人才强教计划资助项目"环境协调连接料与加工技术"学术创新团队计划资助
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| 摘 要： | 针对印刷电路板(PCB)上无铅钎料SnAgCu微小焊点的结晶裂纹,利用设计的试件重现无铅钎料钎焊过程中产生的结晶裂纹,对无铅钎料结晶裂纹进行模拟,同时研究了微量元素的添加对SnAgCu合金焊点结晶裂纹形成的影响。结果表明,在尺寸很小的焊点上仍然存在明显的结晶裂纹。用焊点结晶裂纹的总长度定量地评价无铅钎料结晶裂纹的敏感倾向,添加Ni和Ce元素能够降低无铅钎料结晶裂纹的形成,而P元素的添加却加剧了结晶裂纹的形成,明显增加了焊点处的结晶裂纹。
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| 关 键 词： | 无铅钎料 SnAgCu钎料 结晶裂纹 |
| 收稿时间： | 2008/6/23 0:00:00 |
Solidification crack of SnAgCu lead-free solder joint |
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| DONG Wenxing,SHI Yaowu,XIA Zhidong,LEI Yongping,GUO Fu and LI Xiaoyan.Solidification crack of SnAgCu lead-free solder joint[J].Transactions of The China Welding Institution,2008,29(12):61-63,68. |
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| Authors: | DONG Wenxing SHI Yaowu XIA Zhidong LEI Yongping GUO Fu and LI Xiaoyan |
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| Affiliation: | School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China and School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China |
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| Abstract: | In order to investigate solidification crack of SnAgCu solder joint on the print circuit board (PCB), solidification cracks during solidification are regenerated, the process of the solidification crack formation on the designed specimen is simulated, and the effect of the small element additions on the solidification crack formation of SnAgCu solder joint is researched. Experimental results indicate that some solidification micro-cracks exist significantly on the mini SnAgCu solder joint. The solidification crack susceptibility of Sn-Ag-Cu solder alloy is evaluated by the total crack length of the solder joint, adding trace amounts of Ni and Ce element can depress the solidification crack formation of the solder joints, but adding P element can aggravate the solidification crack formation of SAC305 solder joint and make the crack length evidently increase. |
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| Keywords: | lead-free solder SnAgCu solder solidification crack |
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