| 化学镀Ni-P合金稳定剂的研究 |
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| 引用本文： | 孙华,冯立明.化学镀Ni-P合金稳定剂的研究[J].表面技术,2004,33(5):32-34. |
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| 作者姓名： | 孙华 冯立明 |
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| 作者单位： | 山东建筑工程学院材料科学与工程系,山东,济南,250014;山东建筑工程学院材料科学与工程系,山东,济南,250014 |
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| 摘 要： | 研究了几种稳定剂对化学镀Ni-P合金镀液的影响.采用对比试验比较了镀速和稳定性的变化规律.研究结果表明:稳定剂浓度增大时,镀速先增加至最高值,然后下降.痕量的稳定剂对镀液的稳定性有决定性的影响.得出了较合适的各稳定剂用量范围:稳定剂B和Pb(Ac)2为1～2mg/L;KIO3为6～10mg/L;Na2S2O3为2.5mg/L.对相关稳定剂的机理进行了探讨.
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| 关 键 词： | 稳定剂 沉积速度 镀液稳定性 |
| 文章编号： | 1001-3660(2004)05-0032-03 |
Study on Stabilizers for Electroless Ni-P Alloy Plating |
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| SUN Hua,FENG Li-ming.Study on Stabilizers for Electroless Ni-P Alloy Plating[J].Surface Technology,2004,33(5):32-34. |
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| Authors: | SUN Hua FENG Li-ming |
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| Abstract: | The effects of the electroless Ni-P alloy plating on stabilizers were investigated. By using contrast testing the change laws of stabilizers and depositing velocity were compared. The experiment results showed that the depositing velocity regularly changed with improving the concentration of stabilizers. Firstly the plating velocity increased to the high level, then decreased. Trace stabilizers were the decisive effects of plating stability. The using range of better satisfactory stability could be obtained. The concentration of stabilizers B and Pb (Ac)_2 was added from 1 to 2mg/L. The concentration of KIO_3 was added from 6 to 10mg/L. The concentration of Na_2S_2O_3 was 2.5mg/L. The reason of relative stability was researched. |
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| Keywords: | Stabilizers Depositing velocity Bath solution stability |
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