石墨表面无敏化及活化的化学镀铜法

由于石墨表面具有特殊性,具备自动催化的功能,因此无需敏化、活化等工艺,可直接在石墨表面进行化学镀铜,获得的铜镀层光滑致密,镀液的稳定性好,同时对石墨表面化学镀铜的机理进行了探讨,分析了镀液能稳定进行镀覆反应的原因,并利用SEM对反应初期以及后期的复合粉末进行了观察,证明反应时石墨表面能直接生成大量均匀分布的铜微晶,生长至彼此侧面相连时就得到完整镀层,并且石墨颗粒越小,化学镀铜的活性越高,因而非常适合用于制备高性能的金属石墨复合材料.

Electroless Copper Plating on Graphite Surface without Activation and Sensitization

Graphite particles were coated successfully by electroless copper plating method without activation and sensitize according to the special properties of the surface of the graphite particles. The lubricous cladding material was obtained by this technology and the bath was very stable in this reaction. The theory of this process was discussed and the composite powder was studied by SEM. The small copper particles were found on the surface of the graphite powder drawn from the bath in the early period of the reaction. The final coat arrived when those fine particles grew and met each other. It was found that the smaller particles got the better plating coated. This property met the need of the metal matrix composite materials.