Use of fluorine-doped silicon oxide for temperature compensation of radio frequency surface acoustic wave devices |
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Authors: | Matsuda Satoru Hara Motoaki Miura Michio Matsuda Takashi Ueda Masanori Satoh Yoshio Hashimoto Ken-ya |
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Affiliation: | Microdevice R&D Department, Taiyo Yuden Ltd., Akashi, Japan. matsuda-satoru@jty.yuden.co.jp |
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Abstract: | This paper investigates acoustic properties, including the temperature coefficient of elasticity (TCE), of fluorine-doped silicon oxide (SiOF) films and proposes the application of the films to the temperature compensation of RF SAW devices. From Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. We fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO(3)-substrate structure, and evaluated their performance. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO(2)-based films even when the dopant is added. In comparison with pure SiO(2) with the film thickness h of 0.3 wavelengths (λ), TCF was improved by 7.7 ppm/°C without deterioration of the effective electromechanical coupling factor K2 when r = 3.8 atomic % and h = 0.28λ. Fluorine inclusion did not obviously influence the resonators' Q factors when r < 8.8 atomic %. |
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