钎焊时压力载荷对金刚石接头残余应力的影响

针对金刚石与其他材料连接时接头处容易产生较大的应力而导致接头连接强度下降的问题，采用Marc有限元分析方法，模拟了用Ag—Cu—Ti钎料钎焊金刚石与硬质合金接头的应力分布情况，研究了试件在钎焊过程加载和不加载时对应力分布的影响．结果表明，对试件施加一定的裁荷比未加载荷时接头的最大残余应力值小，且模拟结果具有较高的准确性，为确定实际工艺参数提供了依据．

Effect of Pressed Load on the Residual Stress Distribution of Diamond Bonding

The joint of diamond and other materials is likely to produce larger stress, which results in low strength. The stress distribution on the interface between diamond and cemented carbide is simulated by Marc software in this paper. The effect of load on the stress distribution of the joint is also discussed. The result shows when the joint is put into load during the course of brazing, the maximum residual stress decreases. The stress analysis result is testified by experiment, which offers proofs to find better brazing parameters to improve brazing quality.