复合绝缘导热胶粘剂研究

以增韧的酚醛环氧树脂为基体树脂,氮化铝、氮化硼、氧化铝混杂粒子为导热填料制备了-新型绝缘导热胶粘剂。研究了填料用量对胶粘剂热导率、热阻、介电常数、体积电阻率等性能的影响,发现填料用量为40％时胶粘剂的热导率为O．99 W／mK,热阻为0．70℃／W,介电常数6,体积电阻率4．6×1012Ω·cm,20℃、200℃、250℃下的剪切强度分别为13．0MPa、10．0MPa、5．65MPa。研究结果表明该胶具备良好的电绝缘及力学性能,可以长期在150℃温度下使用,与不加导热填料的相同胶粘剂相比,具有良好的导热能力。

Study on composite insulating heat conductive adhesive

A new insulating heat conductive adhesive was prepared using toughened phenolic epoxy resin as matrix,and the mixture of aluminum nitride,boron nitride and alumina hybrid particles as heat conductive filler. The effects of filler content on the thermal conductivity,thermal resistance,dielectric constant and volume resistivity were investigated,and it was found that the thermal conductivity,thermal resistance,dielectric constant and volume resistivity of the adhesive consisting of 40% filler are 0.99W/mK,0.70℃/W,6 and 4.6×1012Ω·cm, respectively;the shear strength at 20℃、200℃、250℃are 13.0MPa、10.0MPa、5.65MPa,respectively. The results indicate that the developed adhesive possesses good insulating and mechanical properties, also with good heat conduction performance compared with the same adhesive without using thermal conductive filler. In addition,the adhesive can be used long term at 150℃.